ACE and DIVSYS to co-host workshop

February 16, 2016

ACE Production Technologies is pleased to announce that its ACE Component Services Group in conjunction with DIVISYS International, LLC will co-host a solderability testing and component lead tinning workshop in Indianapolis. The workshop will be held Tuesday, March 8, 2016 at DIVSYS International, 8110 Zionsville Road in Indianapolis, Indiana. This technical workshop will include a classroom process training session followed by a Q&A session as well as one-on-one discussion after the workshop is concluded.

Who Should Attend
• Process Engineers
• Manufacturing Engineers
• Quality Personnel
• Procurement Personnel

What They Will Learn
• Understanding the new J-STD-001 Rev F requirements
• Differences between solderability testing and component re-tinning
• Dip and look and wetting balance solderability test methods
• Motivation behind the need to hot solder dip components
• How the new J-STD-001 Rev F impacts you and your company

Solderability is no longer an option for many high reliability segments of the world’s electronics assembly industry. With implementation of the new Rev F of J-STD-001, solderability testing, gold removal and component re-tinning have become prerequisites for doing business and remaining competitive in the global marketplace. This classroom session focuses on the technical aspects of solderability testing and the component re-tinning process. Topics Include:

• Tin whisker mitigation
• Gold embrittlement and removal of gold plating
• RoHS and tin-lead component supply chain trends
• Solderability testing protocols
• MIL-STD-883 and J-STD-002 standards
• SMT and through-hole component re-tinning
• Legacy component refurbishing and RoHS to tin-lead conversion
• ANSI/GEIA-STD-0006 component re-tinning requirements
• Coplanarity and solder thickness

This much anticipated workshop entitled “Solderability and Lead Tinning for the 21st Century” will describe the removal of gold plating, replacing RoHS component finish with tin-lead, refurbishing of legacy components and tin whisker mitigation as the main drivers behind the increasing awareness of component re-tinning using the hot solder dip method. The recommendation that the re-tinning process be carried out using dual dynamic solder pots, controlled flux application and defined process control in accordance with ANSI/GEIA-STD-0006 to enhance component solderability will be discussed extensively.

This highly informative workshop is offered at no cost to all attendees courtesy of ACE Production Technologies and DIVSYS International and covers all aspects of the solderability testing and component re-tinning processes.

[Official Press Release]