ACE announces selective soldering workshops
An introductory workshop will be held February 4-5, 2014 at ACE’s Spokane Valley, WA facility. This comprehensive 2-day workshop is designed to educate and enhance an attendee’s working knowledge of the overall selective soldering process. Topics include component limitations, clearance restrictions, flux chemistries, no-clean processing, and solder joint reliability issues, as well as problem solving and process optimization. The classroom portion will be conducted by well-known process expert Bob Klenke of ITM Consulting while the hands-on portion will be taught by the expert staff members in the ACE application lab.
In addition, an advanced workshop will be held February 25-26, 2014 at the ACE facility. This in-depth 2-day workshop focuses on providing a detailed understanding of printed circuit board construction such as copper layers, barrel plating and porosity. The interaction between the printed circuit board and the selective soldering process as well as the heat flow characteristics within thermally challenging multilayer boards will be defined. The classroom portion of this advanced workshop is instructed by renowned fabrication expert Stan Bentley of DIVSYS International with the hands-on segments taught by the ACE application staff.
These workshops feature a combination of classroom and hands-on curriculum that significantly compresses the learning curve for those new to the selective soldering process or those who wish to advance their in-depth knowledge.[Official Press Release]